현재 문제는 Plan 41의 Cooler에 대한 문제가 아닙니다

현재 문제는 Plan 41의 Cooler에 대한 문제가 아닙니다.
Seal은 미량의 누설을 허용합니다.
API Plan 52에서는 Process가 물로 스며듭니다.
유입되는 양이 작아도 시간이 지나면서 process가 Buffer Fluid에 축적이 됩니다.
이렇게 축적된 Process가 고형화 되어서 문제를 만든다는 사실입니다.
그렇다고 Plan 52보조 장치를 177도 이상으로 유지할 수도 없습니다.
그래서 53B를 추천하는 것입니다. Process가 유입되지 않도록 방지해야 합니다

결과 (영어) 1:

The current problem is that the Plan is not a problem for 41 Cooler.Seal is a small amount of leakage.API Plan 52, the Process is water.Over time, even with the amount of Fluid that accumulates in the process Buffer.This is the problem of accumulated Process creates a solidified.However, even more than the secondary device Plan 52 177 you cannot keep.So I recommend 53B. You must prevent the Process

결과 (영어) 2:

Current issue is not about the Cooler's Plan 41.
Seal allows a small amount of leakage.
API Plan 52 In deupnida Process is soaked with water.
Is the amount flowing into smaller over time and process is stored in the Buffer Fluid.
This accumulated Process is a fact that makes the problem be solidified.
This does Plan 52 may not maintain a secondary device even more than 177.
So the recommendation is to 53B. Process must prevent from entering

결과 (영어) 3:

at present, the problem of Cooler plan 41 of the problem. Seal, a small amount of leakage is not allowed.
api plan 52, Process is water, oil, not very much. the amount is small, over time Buffer Fluid is in process. accumulation. the accumulation, it is your phone, Process problems. this is a fact. but the plan, the device 52 is 177 above can be maintained. 53B, so recommend.is not to prevent the flow Process.