Compression Moldingd은 반드시 사용.Transf

Compression Moldingd은 반드시 사용.

Transfer Mold의 경우에도 Mold 품질, 금형 보호를 위해 적용.

Mold Die 내부에 대한 Burr / flash 를 방지.

Mold Die로부터 제품이 쉽게 Release 되어 생산성 향상.

Package 쿠션 효과로 Chip Surface의 Cracking 현상 방지.

Ejector Pin을 사용해 분리하는 기존 프로세스를 단축.

Chase Mold 내부가 Clean 하여 유지보수관련 시간, 비용 절감.

몰드 클리닝 멜라민 사용 억제에 의한 사용자 편의성 확보.

eMUF Package에 적용하여 Chip 외관 보호.

eMUF Package에 적용시 제전 처리로 ESD로부터 Chip 회로 보호

결과 (영어) 1:

Compression Moldingd must be used.Transfer Mold mold Mold, even if the quality, of the protection applied for.Mold Die for the inside to prevent Burr/flash.Mold Release products are easily Die from increased productivity.Package Surface Cracking of Chip resistant cushion effect.Ejector Pin to disconnect an existing process by using the shortcut.Maintenance Clean the Mold inside Chase time, cost savings.Mold Cleaning melamine use to inhibit the user's convenience.EMUF Chip appearance by applying protection Package.EMUF applied to the ESD Package dealing with the Chip from my ex at circuit protection

결과 (영어) 2:

Compression Moldingd must be used. Transfer For Mold applied for in Mold quality, mold protection. Mold Die prevent Burr / flash on the inside. Mold enhancement products are readily Release productivity from Die. Package cushioning effect to the Chip Surface of Cracking Prevention.. reduce the existing process of separation using Ejector Pin Chase Mold inside of the Clean maintenance time and costs. usability ensured by the mold cleaning melamine used suppressed by applying the eMUF Package Chip exterior protection. eMUF Package Chip from ESD antistatic treatment applied to the City Circuit Protection