Compression Moldingd은 반드시 사용Transfe

Compression Moldingd은 반드시 사용
Transfer Mold의 경우에도 Mold 품질, 금형 보호를 위해 적용
Mold Die 내부에 대한 Burr / flash 를 방지
Mold Die로부터 제품이 쉽게 Release 되어 생산성 향상
Package 쿠션 효과로 Chip Surface의 Cracking 현상 방지
Ejector Pin을 사용해 분리하는 기존 프로세스를 단축
Chase Mold 내부가 Clean 하여 유지보수관련 시간, 비용 절감
몰드 클리닝 멜라민 사용 억제에 의한 사용자 편의성 확보
eMUF Package에 적용하여 Chip 외관 보호
eMUF Package에 적용시 제전 처리로 ESD로부터 Chip 회로 보호

결과 (영어) 1:

Compression Moldingd is requiredTransfer Mold Mold, even if the quality of the mold, applied for the protection ofMold Die for the inside to prevent Burr/flashMold Release products are easily Die from improved productivity.Package Surface Cracking of Chip resistant cushion effectEjector Pin to disconnect an existing process by using the shortcodeMaintenance Clean the Mold inside Chase time, cost savingsMold Cleaning melamine use in deterring secured user convenienceEMUF Chip appearance by applying protection PackageEMUF applied to the ESD Package dealing with the Chip from my ex at circuit protection

결과 (영어) 2:

Compression Moldingd must use
Transfer Mold's case, Mold quality, mold protect to apply
Mold Die inside for Burr / flash to prevent
Mold Die from the product is easy to Release the productivity gains
Package cushioning effect to the Chip Surface of Cracking Prevention
Ejector Pin and the shortening existing processes to separate using
Clean Chase Mold inside of the maintenance time and cost savings
usability ensured by the mold cleaning melamine used suppression
Chip exterior protection applied to eMUF Package
from ESD as a city festival treatment applied to eMUF Package Chip Circuit Protection

결과 (영어) 3:

压缩moldingd은반드시사용의경우에도转移模具模具품질，금형보호를위해적용模具내부에대한毛刺/闪光를방지模具로부터제품이쉽게释放되어생산성향상包쿠션효과로芯片表面의开裂현상방지顶针을사용해분리하는기존프로세스를단축把模具내부가清洁하여유지보수관련시간，비용절감몰드클리닝멜라민사용억제에의한사용자편의성확보emuf包에적용하여芯片외관보호emuf包에적용시제전처리로ESD로부터芯片회로보호