현재 문제는 Plan 41의 Cooler에 대한 문제가 아닙니다

현재 문제는 Plan 41의 Cooler에 대한 문제가 아닙니다.
Seal은 미량의 누설을 허용합니다.
API Plan 52에서는 Process가 Buffer로 스며듭니다.
유입되는 양이 작아도 시간이 지나면서 process가 Buffer Fluid에 축적이 됩니다.
이렇게 축적된 Process가 고형화 되어서 문제를 만든다는 사실입니다.
그렇다고 Plan 52보조 장치를 177도 이상으로 유지할 수도 없습니다.
그래서 53B를 추천하는 것입니다. Process가 유입되지 않도록 방지해야 합니다

결과 (영어) 1:

The current problem is that the Plan is not a problem for 41 Cooler.Seal is a small amount of leakage.API Plan 52, the Process as a Buffer.Over time, even with the amount of Fluid that accumulates in the process Buffer.This is the problem of accumulated Process creates a solidified.However, even more than the secondary device Plan 52 177 you cannot keep.So I recommend 53B. You must prevent the Process

결과 (영어) 2:

Current issue is not about the Cooler's Plan 41.
Seal it allows a small amount of leakage.
The API Plan 52 deupnida Process is permeated with Buffer.
The amount of inflow is the smaller accumulated in the process the Buffer Fluid over time .
This fact makes the problem of accumulated Process be the solidification.
This does Plan 52 may not maintain a secondary device even more than 177.
So the recommendation is to 53B. Process must prevent from entering

결과 (영어) 3:

at present, the problem of Cooler plan 41 of the problem. Seal, a small amount of leakage is not allowed., 52, Process api plan is to create Buffer,., into the amount of the small, but over time Buffer Fluid is in process. accumulation. the accumulation, it is your phone, Process problems. this is a fact. but the plan, the device 52 is 177 above can be maintained. 53B, so recommend.is not to prevent the flow Process.